Packaging Technician - Nozay, France - NOKIA

NOKIA

Entreprise vérifiée

Nozay, France

il y a 3 semaines

Posté par:

Sophie Dupont

beBee Recruiter

Description

Join us in creating the technology that helps the world act together
We are a B2B technology innovation leader pioneering the future where networks meet cloud.

At Nokia you will have a positive impact on people's lives and help build the capabilities needed for a more productive, sustainable, and accessible world.

Be part of a culture built on an inclusive way of working where we are open to your ideas, you are empowered to take risks and are encouraged to be fearless in bringing your authentic self to work.

The team you'll be part of

Our group is a research and development team (dynamic and caring team of 10 researchers and technicians) working on microelectronic and optoelectronic components for high-speed optical fiber telecommunications.

The work environment is a Joint Venture (in French "GIE") between Nokia and other entities. Employees are members of Nokia Strategy and Technology.

Strategy and Technology lays the path for Nokia's future technology innovation and identifies the most promising areas for Nokia to create new value.

We set the company's strategy and technology vision, offer an unparalleled research foundation for innovation, and provide critical support infrastructure for Nokia.

What you will learn and contribute to

The main activity will consist in realizing meticulous assemblies by mounting electronic chips in packages and realizing the cabling according to a design provided by the team.

Are you passionate about solving problems?

As part of our team, you will realize:

Electronic boards preparation (capacitances, Resistors, connectors)
Opto and microelectronics modules assembly (ICs, ceramic and SMT components mounting)
Cabling (bonding) of components (ball bonding, ribbon, etc.) on Kulicke & Soffa machines
Stock management of furniture for the mounting laboratory

Your skills and experience

You have:

Meticulousness, thoroughness and diligence, curiosity
Taste for precise manual work
Ability to work in a stimulating environment

It would be nice if you also had:

A previous experience in mechanical drawings would be a plus

What we offer

Nokia offers flexible and hybrid working schemes, continuous learning opportunities, well-being programs to support you mentally and physically, opportunities to join and get supported by employee resource groups, mentoring programs and highly diverse teams with an inclusive culture where people thrive and are empowered.

Nokia is committed to inclusion and is an equal opportunity employer
Nokia has received the following recognitions for its commitment to inclusion & equality:

One of the World's Most Ethical Companies by Ethisphere
Gender-Equality Index by Bloomberg
Workplace Pride Global Benchmark

At Nokia, we act inclusively and respect the uniqueness of people.

Nokia's employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law.

We are committed to a culture of inclusion built upon our core value of respect.

Join us and be part of a company where you will feel included and empowered to succeed.

_III-V Lab, the joint lab of Nokia Bell Labs, Thales TRT and CEA Leti :_- These activities cover the following topics:

Photonic Integrated Circuits (PICs) for telecoms;
Micro/nanoelectronic circuits for telecoms: 40Gb/s, 100Gb/s and over;
High resolution infrared imagery sensors ;

Located in Palaiseau, near Paris, its facilities include 4,000 m2 of clean rooms. Its staff is composed of around 100 permanent Researchers, plus around 25 PhD Students.

III-V Lab masters the different steps needed to manufacture III-V components from design to characterisation:
Design and modelling: electro-optical modelling for DFB, DBR and FP lasers, modulators and photo-detectors, electrical and thermal modelling of RF and power components;
Epitaxy: MOCVD, MOVPE, MBE and GSMBE, including regrowth, selective area growth (SAG), buttjoint » and buried layers

Materials:
GaN, AlGaN, InAlN, GaAs, InP, InGaAs, GaSb etc

Process: metal and dielectric layer deposition, electronic lithography, stepper, etching (IBE, RIE, ICP, ebeam );
Reliability: aging testbenches for electronic components and lasers ;
Hybridisation: III-V on Si or other (molecular adherence, Indium bumps) ;
Modules: design and fabrication of power RF electronic circuits and modules, lasers / photo receiver modules (pigtailed or not), PIC modules.

III-V Lab has also the capacity to produce limited quantities of epitaxial wafers, components, modules or subsystems). Such capacity is particularly adapted to address in a flexible way the rapid evolution of the market, offering to its members or partner industrial companies an early access to the components for their system development and even preliminary deployment; in a second step,